基于半导体晶圆激光切割工艺的质量控制

Quality Control Based on Semiconductor Wafer Laser-cutting Process

随着集成电路制造的高集成度、高性能发展,晶圆趋于更薄更轻,对晶圆的加工要求也就更加苛刻。激光切割作为一种新的加工手段已经成为半导体行业重要的制备工艺。半导体晶圆激光切割设备知识密集度高、工艺难度大,其工艺质量对最终产品质量和经济效益起着决定性的作用。针对激光工艺开发及管理过程面临不断探索创新的现象,以激光切割工艺机理为基础,结合研制生产过程实践,分析人员、设备、材料、方法和环境等对工艺质量的影响,从策划、实施、测试检验和持续改进的全过程对半导体晶圆激光切割工艺进行剖析,建立了一系列的应对措施以保证工艺质量稳定,进一步地提高加工产品的可靠性。同时,对同类工艺过程质量的控制具有一定的借鉴作用。

With the development of high integration and high performance in integrated-circuit manufacturing,wafer integration tends to be thinner and lighter,which requires high-precision process.As a new processing method,laser-cutting has become an important manufacturing process in semiconductor industry.Semiconductor laser-cutting equipment has high knowledge intensity and difficult process.Its process quality plays a decisive role in the quality and economic benefits of the final product.The management process of laser-cutting process needs continuous exploration and innovation,based on the mechanism of laser cutting process and the practical production process,the effects of personnel,equipment,materials,methods,environment on the quality of the process have been investigated.Additionally,the entire process of planning,implementation,test inspection and continuous improvement for the laser cutting have been analyzed.A series of countermeasures have been established to confirm the stability of process quality and improve the reliability of processed products,which also provides reference for the quality control of similar processes.