复型试验方法在电子设备结构损伤检测中的应用

Application of Replica Test Method in the Damage Detection of the Structure of Electronic Equipment

电子设备作为重要的机载产品,长期承受温度和振动等因素的作用,因此,其结构容易产生疲劳裂纹。结构裂纹具有隐蔽性、易扩展和破坏性强等特点,及早发现裂纹对于保障产品的可靠性具有重要的意义,因而其也一直是研究的重点。目前裂纹检测手段主要以宏观探测为主,较少对裂纹扩展进行实时微观分析。针对电子设备的结构,采用复型试验方法对裂纹进行检测,在电镜下观察微观扩展形貌,研究小尺度下裂纹的微观扩展机理,对于及早发现裂纹并获得其扩展趋势具有一定的参考价值。

As an important airborne product,electronic equipment is subjected to the effect of temperature and vibration for a long time,so fatigue cracks easily emerge in its structure.Structural cracks have the characteristics of concealment,easy expansion,and strong destructiveness.The early detection of cracks has important significance for ensuring the reliability of products,so it has always been the focus of research.At present,crack detection methods are mainly based on macroscopic detection,and real-time microscopic analysis of crack propagation is rarely performed.Aiming at the structure of electronic equipment,the crack is detected by replica test method.The microscopic expansion morphology is observed under the electron microscope,and the microscopic propagation mechanism of the crack at a small scale is studies,which has a certain reference significance for early detection of cracks and obtaining their expansion trend.