期刊文献+

电沉积法制备Ni-GO复合镀层的工艺及力学性能研究 被引量:3

Study on the Process and Mechanical Properties of Ni-GO Composite Coating Prepared by Electrodeposition
下载PDF
导出
摘要 采用电沉积方法制备了镍-氧化石墨烯(Ni-GO)复合镀层,采用SEM、XRD分析了NiGO复合镀层的表面形貌、组织结构和组分含量,研究了氧化石墨烯浓度、沉积电流密度和温度对复合镀层微观结构的影响规律,并对镀层的力学性能进行了测试分析。结果表明,在沉积电流密度2 A/dm^2、氧化石墨烯浓度0.2 g/L、沉积温度50℃的工艺条件下,制备出了石墨烯在镍基体中均匀分布的镀层,制备的复合材料显微硬度达到了600 HV,约为纯镍的2倍。XRD测试结果表明加入的氧化石墨烯改善了材料的晶粒尺寸分布,抑制了镍的生长且细化了晶粒,从而提高了复合材料的力学性能。 Ni-GO composite coatings were prepared by electrodeposition method.The surface morphology,microstructure and composition content of Ni-GO composite coatings were tested by SEM and XRD,and the effect of graphene oxide(GO)concentration,current density and temperature on the properties of composite coatings were studied.The mechanical properties of Ni-GO composite coating were tested.The results showed that the graphene reinforced nickel-based material grew uniform spherical structure on the surface when the current density of 2 A/dm^2,the deposition temperature of 50℃and the GO concentration of 0.2 g/L,the microhardness of the composite material reached 600 HV,which was 2 times than that of pure nickel.The XRD results showed that the graphene improved the grain size of the material,inhibited the growth of nickel and refined the grain size,thus improving the mechanical properties of the composite.
作者 张雪娜 冯贝贝 索文华 杨子晨 闻家成 张洪强 ZHANG Xuena;FENG Beibei;SUO Wenhua;YANG Zichen;WEN Jiacheng;ZHANG Hongqiang(Cangzhou Technical College,Cangzhou 061001,China;School of Materials Science and Engi-neering,Beijing University of Technology,Beijing 100022,China)
出处 《电镀与精饰》 CAS 北大核心 2020年第8期1-6,共6页 Plating & Finishing
关键词 电化学沉积 Ni-GO复合镀层 氧化石墨烯 力学性能 electrochemical deposition Ni-GO composite coating graphene oxide mechanical properties
  • 相关文献

参考文献4

二级参考文献28

  • 1常光幸美,表面技术,1995年,46卷,577页
  • 2Cheng C,Scr Metall Mater,1994年,31卷,735页
  • 3李佐宜,薄膜科学与技术,1994年,17卷,1页
  • 4李戈扬,薄膜科学与技术,1993年,6期,45页
  • 5YEH Y M, CHEN CH S, TSAI M H, et al.. Effect of pulse reverse current on microstructure and properties of electroformed nickel-iron mold insert[J]. Jap. J. Appl. Phys. , 2005, 44(2): 1086-1090.
  • 6SANKAR P R, KHATTAK B Q, JAIN A K, et al.. Electroforming of copper by periodic reversal process[J].Surf. Eng. , 2005, 21(3): 204-208.
  • 7WONG K P, CHAN K C, YUE T M. Modeling the effect of complex waveform on surface finishing in pulse current eleetroforming of niekel[J]. Surf. Coat. Technol. , 2000,135 (1): 91- 97.
  • 8WONG K P, CHAN K C, YUE T M. Modeling of electrocrystallization for pulse current electroforming of nickel[J]. Appl. Surf. Sci., 2001,178(2) :178-189.
  • 9QU N S, CHAN K C, ZHU D. Surface roughening in pulse current and pulse reverse current electroforming of nickel[J]. Surf. Coat. Technol. , 1997,91(3): 220-240.
  • 10邹志强,李明,蒋志红,罗才卿,沈德芳.Tb/Co成分调制膜的磁、磁光性能和热稳定性[J].金属学报,1997,33(7):749-755. 被引量:1

共引文献121

同被引文献41

引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部