模内微装配成型微装配界面熔接黏附脱黏剥离特性

Fusion Adhesion Debonding and Peeling Characteristics of the Interface of In-Mold Micro-Assembly Molding

如何准确预测和调控微装配界面熔接黏附脱黏剥离特性是聚合物模内微装配成型制备高性能微型机械运动的关键科学与技术问题。针对这一关键科学与技术问题,构建了模内微装配成型微型机械运动副界面熔接黏附脱黏剥离行为的模拟仿真平台和注射温度-材料副界面脱黏剥离断裂韧性参数-界面熔接黏附脱黏剥离特性的关联关系。研究表明,运动副微装配界面的启裂应力、临界应变能释放率和完全脱黏剥离驱动力与二次成型熔体注射温度呈正相关关系,降低二次成型注射温度,可以明显减小界面的启裂应力和临界应变能释放率,抑制微装配界面的熔接黏附,有利于降低微装配界面熔接黏附脱黏剥离的驱动力,提高微装配界面的可运动性能。

How to predict and control the micro-assembly interface fusion adhesion debonding and peeling characteristics accurately is a key scientific and technical problem in the preparation of high-performance micro-mechanical motion in polymer in-mold micro-assembly.Aiming at this key scientific and technical problem,the simulation platform of the in-mold micro-assembly micro-mechanical motion interface fusion adhesion debonding and peeling behavior was constructed,and the relationship among injection temperature-debonding and peeling fracture toughness parameters of material pair interface-interfacial fusion adhesion debonding and peeling characteristics was built.The research shows that the crack initiation stress,critical strain energy release rate and the driving force of complete debonding and stripping in the micro assembly interface are positively correlated with the injection temperature of the secondary molding melt.The reduction of the secondary molding injection temperature can significantly reduce the crack initiation stress,critical strain energy release rate in the micro assembly interface,and inhibit the fusion adhesion of the micro-assembly interface,which is beneficial to reduce the debonding and peeling driving force of the micro-assembly interface fusion adhesion,and improve the movable performance of the micro-assembly interface.