基于正交试验的低温电镀铁工艺探讨

Discussion of Low-temperature Iron Plating Process Based on Orthogonal Test

为获得适宜的无刻蚀低温电镀铁工艺,以主盐(FeCl2·4H2O)浓度、镀液pH值、镀液温度和电流密度为因素,以沉积速率、维氏硬度、腐蚀速率及耐磨性为性能评价指标,进行了四因素三水平的正交试验。结果表明,电流密度是沉积速率的主要影响因素,镀液pH值是镀层维氏硬度和耐蚀性的主要影响因素,镀液温度为镀层耐磨性的主要影响因素;无刻蚀低温镀铁最佳工艺参数:主盐浓度为400 g/L,pH值为1.0,温度为35℃,电流密度为15 A/dm 2。

In order to obtain the suitable non-etching low temperature iron plating process,the four factors and three levels of orthogonal experiment was carried out with the main salt concentration,the plating bath pH range,the plating bath temperature and current density as factors,and the deposition rate,Vickers hardness,corrosion rate and wear resistance as performance evaluation indicators.The results showed that the current density was the main factor affecting the deposition rate,the plating bath pH rang was the main factor affecting the Vickers hardness and corrosion resistance of the coating,and the plating bath temperature was the main factor affecting the wear resistance of the coating.The best process parameters of non-etching low-temperature iron plating were as follows:concentration of main salt was 400 g/L,pH range was 1.0,temperature was 35℃,current density was 15 A/dm 2.