Ni-Cu泡沫强化In-Sn复合钎料低温钎焊镀银铝合金板接头组织及力学性能研究

Study on the microstructure and mechanical properties of Ag-plated Al alloy joints soldered with Ni-Cu foam reinforced In-Sn composite solder at low temperature

采用60%和80%孔隙度Ni-Cu合金泡沫强化/In-Sn复合钎料于160℃对镀银铝合金板进行低温钎焊连接,文中研究了钎焊时间对钎焊接头显微结构及力学性能的影响。结果表明,随着钎焊时间的延长,界面处的Ag2In逐渐增厚,钎缝中(Cu,Ni)6(Sn,In)5和(Cu,Ni)6Sn5反应物逐渐增多。80%和60%孔隙度强化的复合钎料钎焊接头的抗剪强度均随钎焊时间的延长而提高,在120 min时,钎焊接头的抗剪强度达到最高值,分别为18.4 MPa和31.5 MPa,相较于纯In-Sn共晶钎焊接头强度(6.81 MPa)分别提升了2.7倍和4.6倍。

60%and 80%porosity Ni-Cu alloy foam reinforced In-Sn composite solder was used to solder Ag-plated Al alloy plate at 160℃.Effects of soldering time on the microstruture and mechanical properties was investigated.The results showed that the thickness of interfacial Ag2In IMC layer and amounts of(Cu,Ni)6(Sn,In)5 and(Cu,Ni)6Sn5 particles were increased with increasing soldering time.The shear strength of joints soldered with 80%and 60%Ni-Cu foam reinforced composite solders were both increased with increasing soldering time,the highest shear strength of which were 18.4 MPa and 31.5 MPa,respectively when soldered for 120 min.These values were 2.7 times and 4.6 times larger than the strength of joint soldered with In-Sn eutectic solder(6.81 MPa).