破坏性键合拉力试验的测量系统分析

Measurement System Analysis of Destructive Wire Bonding Pull Test

引线键合是半导体封装工艺中的一项关键工艺,其中破坏性键合拉力是评估键合质量的关键项目之一。为了确保破坏性键合拉力测试结果的正确性,需使用测量系统分析(MSA)方法对获得测量数据的测量系统进行评估。测量系统分析主要评估测量系统的重复性和再现性,测量系统的重复性和再现性由Gage R&R研究来确定。测量系统分析也是ISO/TS 16949标准中的核心要素之一。测量系统根据其测量对象的特性,可分为非破坏性试验的测量系统和破坏性试验的测量系统,后者与前两者的分析方法有较大差异,而对于破坏性的测量系统目前相关研究不多。通过实例,运用Minitab软件,探讨了破坏性键合拉力试验的测量系统分析方法。

Wire bonding is a key process in the semiconductor package process,in which destructive wire bonding pull is one of the key items for evaluating the bonding quality.In order to ensure the correctness of the destructive bond pull test results,the measurement system that obtains the measurement data is evaluated by using the Measurement System Analysis(MSA)method.The measurement system analysis mainly evaluates the repeatability and reproducibility of the measurement system.The repeatability and reproducibility of the measurement system are determined by the Gauge R&R study.Measurement system analysis is also one of the core elements of the ISO/TS 16949 standard.The measurement system can be divided into non-destructive testing systems and destructive testing systems based on the characteristics of its measurement objects.The analysis methods of the two testing systems are quite different.For destructive measurement systems,there are not many academic papers currently studied.In this article,based on an example,the measurement system analysis method of the destructive wire bonding pull test was discussed through using Minitab software based on an example.