基于探针连接器的弹性测试技术研究

Research on Elastic Testing Technology Based on Probe Connector

采用压接式探针连接器对BGA封装微模块进行高效率、无损伤测试会发生测试曲线畸变失真现象。仿真分析测试模具引入导致“微模块-测试模具-测试板”组成的测试系统性能变差的原因。详细分析了介电常数、限位间距、限位间隙等参数对系统射频传输性能的影响,发现介电常数和限位间隙的变化对系统性能的影响较大,限位间距变化时系统的性能几乎不变。

The test curve distortion will occur when the BGA package micromodule is tested with high efficiency and no damage using the crimping probe connector.Simulation analysis is made to search on the reason of the poor performance of the test system composed of"micro-module-test mould-test board"caused by the introduction of test mould.The influence of parameters such as permittivity,limit spacing and limit gap on the radio frequency(RF)transmission performance of the system is analyzed in detail.It is found that the changes of the permittivity and limit gap have great influence on the performance of the system.The limit spacing has a negligible effect on the system.