摘要
在航天产品微组装工艺中,锡铅焊料因其具有优异的焊接性能和高可靠性的特点而被广泛使用。但在微波组件真空回流焊接中,锡铅合金与镀金焊盘生成脆性的金属间化合物,引起“金脆”现象,造成产品失效,故需在焊接前对焊盘进行搪锡去金处理,提升焊点及产品的可靠性。介绍了某微波组件真空回流焊接中对微带板表贴焊盘进行搪锡去金处理的工艺方法,经试验验证该工艺有效提升了焊点的长期可靠性。
Sn-Pb solder was widely used in micro-assembly technology of aerospace electronic products due to its excellent soldering property and high reliability.Sn-Pb alloy reacts with gold of gold-plated pads producing brittle intermetallic compound during vacuum reflow soldering of microwave module.Brittle intermetallic compound will cause gold embrittlement and lead to invalid of electronic products.The de-golding process of gold-plated padsis necessary in order to improve the reliability of solder joints and products.In this paper,the process method of the tin-coating and de-golding of the microstrip plateis introduced,and the long-term reliability of the welding point is improved by the experiment.
作者
张建
金家富
张丽
李安成
汪秉庆
ZHANG Jian;JIN Jiafu;ZHANG Li;LI Ancheng;WANG Bingqing(No.38 Research Institute of China Electronics Technology Group Corporation,Hefei 230088,China)
出处
《电子与封装》
2020年第9期61-64,共4页
Electronics & Packaging
关键词
金脆
搪锡去金
丝网印刷
真空回流焊接
gold embrittlement
tin-coating and de-golding
silk screen printing
vacuum reflow soldering
