C波段小型化双通道变频收发模块设计

Design of a C-band dual-channel miniature frequency conversion T/R module

基于MMIC与微组装工艺技术设计实现了一款C波段小型化双通道变频收发模块。分别对模块内主要性能指标的设计方法进行阐述,重点采用HFSS全波仿真软件对壳体烧结器件与多层板互连时造成的带内平坦度问题进行仿真优化,最终在狭小的空间内完成了模块设计与实现。测试结果表明,模块性能可靠稳定,达到预期效果。

A C-band dual-channel miniature frequency conversion T/R module is designed based on the MMIC and micro-assembly process technology(MPT),and the design methods of the main specifications of the module are expounded respectively.The HFSS full-wave simulation software is used to optimize the in-band flatness caused by interconnection between shell sintered devices and multilayer boards.Finally,the module is designed and implemented in narrow and small space,and the test results show that the performance of the module is reliable and stable,achieving the desired results.