氧化铝陶瓷基板紫外纳秒激光打孔工艺研究

Research on Nanosecond Pulse Laser Drilling Processing of Alumina Ceramic Substrate

氧化铝陶瓷基板作为雷达微波组件的核心部件,其硬脆特性使得传统加工方法在导通孔加工中存在很多限制。激光加工作为一种非接触式高能束加工方法,是氧化铝陶瓷表面孔加工的最优选择。文中主要研究了紫外纳秒激光氧化铝陶瓷表面孔加工中的激光加工参数(包括激光平均功率、扫描速度和扫描次数等)对孔的特征尺寸(包括入口直径、出口直径和锥度)的影响规律,并分析了各种规律产生的相关机理。此研究为雷达微波用电子陶瓷基板的导通孔加工提供了有力的理论依据和技术支持。

As the core component of radar microwave module, alumina(Al2O3) ceramic is a hard and brittle material, which limits the through hole processing by traditional processing methods. Laser machining, a noncontact high-energy beam machining method, is the best choice for hole ablation on Al2O3 ceramic surface. The effects of laser processing parameters(including the average laser power, the scanning speed and the scanning times) on the characteristic sizes of holes(including inlet diameter, outlet diameter and taper) are studied and the relevant mechanisms are analyzed in this paper. This study provides significant theoretical and technical support for through hole drilling of electronic ceramic substrates for radar microwave.