3D芯片热管理技术的专利分析

Patent Analysis for Heat Management of 3D Chip

本文以专利为切入点,探索3D芯片热管理技术的竞争态势和研发方向。以经过遴选的中国专利文摘数据库中的3D芯片热管理相关技术专利为研究对象,从专利的申请状况、申请人的重要技术点、技术研发趋势等方面,研究中国3D芯片热管理技术的专利发展情况,希望通过对3D芯片热管理的专利技术分析,对业内人士有所启示和帮助。

The paper explores the competition landscape and development trend of heat management of 3D chip related technology from patents.It chooses patents collected from the CNABS patent database to research the patent layout of heat management of 3D chip in accordance with following aspects:the patent application situation,the characteristics of important applicants,the development trend and so on.According to the research of patent layout on heat management of 3D chip related technology,it is hoped to be useful for the researchers in this field.