基于激光影像的BGA/CCGA器件共面度自动检测研究

Research on Automatic Detection of Coplanarity of BGA/CCGA Device Based on Laser Image

焊球栅状阵列(BGA)∕陶瓷柱栅状阵列(CCGA)封装器件在宇航电子产品中被广泛应用,其共面度检测非常重要。以激光影像测量技术为理论基础,针对BGA∕CCGA器件的共面度检测问题,提出了一种非接触式的引脚共面度自动检测方案。通过对常见器件的共面度检测方法开展研究与实践,实现了快速、高效、精准检测的目标,同时进行了焊接试验验证,结果表明BGA∕CCGA引脚共面度与焊点质量均满足航天标准要求。

BGA∕CCGA grid array packaging devices are widely used in aerospace electronic products,and their coplanarities detection are very important.This paper takes laser image measurement technology as the theoretical basis and proposes a non-contact pin coplanarity automatic detection scheme for the coplanarity detection of BGA∕CCGA devices.Through research and practice on the coplanarity detection methods of common devices,the goal of fast,efficient and accurate detection is achieved,and soldering test verification is conducted.The results show that the BGA∕CCGA pin coplanarity and solder joint quality meet the aerospace standard requirement.