动车组逻辑控制机箱热仿真及试验研究

Thermal Simulation and Experimental Research of EMU Logic Control Box

针对动车组电气屏柜中逻辑控制机箱内继电器表面温度过高的问题,提出一种改善继电器表面温度的散热结构。通过仿真,分析了改进前后的逻辑控制机箱在全功率运行时继电器表面温度和逻辑控制机箱内腔温度的变化,并通过温升试验进行了验证。仿真和试验结果表明,散热结构对继电器表面温度和逻辑控制机箱内腔温度有一定的改善作用。

Aiming at the problem of over temperature of relay surface in logic control cabinet of EMU, a heat dissipation structure was proposed to improve the relay surface temperature. Through simulation, the changes of relay surface temperature and inner cavity temperature of logic control cabinet before and after the improvement were analyzed when the logic control cabinet was in full power operation, and verified by temperature rise test. The simulation and test results showed that the heat dissipation structure could improve the relay surface temperature and the inner cavity temperature of the logic control box.