镀锡板基材表面小白线缺陷形成原因分析

Analysis of Tiny White Line Defect on the Surface of Tinplate Substrate

采用扫描电镜对供二次冷轧的镀锡板基板表面小白线缺陷进行了全面分析,结果表明,基板表面的小白线缺陷实质是一种表面微损伤,缺陷部位实际上由大量宽度在20μm、长度不一的微擦伤形貌组成,缺陷部位表面嵌入了大量富含Al、Si、O等成份的颗粒物。工序分离实验证实该缺陷来自热轧工序,通过对热轧层流冷却段之后靠近侧导板区域辊系表面进行清理,缺陷消失。

The small white line defect on the surface of tinplate used for double cold-reduction was analyzed by SEM.The results show that the white line defect on the surface of tinplate is actually a kind of surface micro damage.The defect site is composed of a large number of micro scratch morphology with different length.The micro particles rich in Al,Si and O and with the size of about 20μm are embedded on the surface of the defect part.Through the process separation experiment,it is confirmed that the defect comes from hot rolling process.After cleaning the surface of roll system near the side guide plate after the laminar cooling section,the defect disappears.