基于大气等离子体烧结技术的硅晶圆加工废料回收工艺研究

Silicon Wafer Waste Recycling Based on Atmospheric Plasma Sintering Technology

目前的硅晶圆加工过程中通常会对直拉法制成的单晶硅棒进行线切割操作,从而得到单晶硅圆薄片,但该过程会造成较大的单晶硅材料浪费.因此,寻求各种方法回收晶体硅切割废料成为一个重要课题.本文根据加工样本与加工仪器的特性,探究了利用放电等离子体烧结技术加工回收单晶硅粉末技术的可能性,并基于这些成果调节工艺参数进行了烧结实验.通过表征观察烧结成品的表面形貌与元素组成后,可观察到其含有氧化膜与其他杂质,且该成品具有在经过优化实验步骤与进一步处理后可回收的潜力.

The manufacture of silicon wafer requires a important method:wire-electrode cutting of the silicon single crystal rod.Due to the fact that this process will result in a large waste of monocrystalline silicon material,seeking for multiple ways to recycle those cutting waste has become an important topic.The possibility of using plasma sintering technology to recycle monocrystalline silicon powder was investigated according to the characteristics of the samples and the processing instrument.Based on these results and after adjusted the technological parameters,and due to the limitation of time,equipment and other factors,only one experiment was carried out.After the surface morphology and elemental analysis for the sintered sample,the surface of the sintered product containing oxide film and other impurities can be obtained.And the product has the potential to be recycled after the optimization of experimental steps and further processing.