某固态微波炉功放模块散热优化设计

Heat Dissipation Optimization Design of Power Amplifier Module for a Solid State Microwave Oven

针对某固态微波炉功放模块的散热结构进行研究,基于现有的功放模块散热结构,通过对比实验和仿真功放模块的温度来校准仿真模型的参数和影响因素,可使仿真结果和实验测试结果吻合较好,进而可利用仿真的方法对功放模块的散热结构进行优化设计。为了实现散热模块的扁平化,采用鼓风机替代原轴流风扇,优化后的功放模块散热结构可使功放模块的整体高度降低50%以上;优化后功放模块晶体管温度降低17%左右,且功放铜基板和铝散热器的温差缩小至10℃左右,散热效果较之前更好。

This paper mainly studies the heat dissipation structure of power amplifier module for a solid-state microwave oven.Based on the existing power amplifier module heat dissipation structure,the simulation model parameters and influencing factors are calibrated by comparing the experimental and simulated power amplifier module temperature,which can make the simulation results and experimental test results agree well,and then the simulation method can be used to optimize the thermal structure of the power amplifier module.In order to realize the flattening of the heat dissipation module,the blower is used to replace the original axial-flow fan.After optimization,the overall height of the power amplifier module can be reduced by more than 50%.After optimization,the transistor temperature of the power amplifier module is reduced by about 17%,and the temperature difference between the copper substrate and the aluminum radiator is reduced to about 10℃.The heat dissipation effect is better than before.