定形相变墙板的制备及其调温性能研究

Preparation and properties of shape stabilized phase change material wallboards

通过直接混合法分别制备了相变材料含量为5%、10%和15%的LA-TD/SiO2定形相变墙板,采用高低温交变箱模拟夏季室外温度环境,从墙板内外表面温度、墙板内表面热流及墙板导热系数三个方面实验研究了定形相变墙板的热工性能。结果表明:随着相变材料含量的增加,定形相变墙板的内表面峰值温度和峰值热流逐渐降低,导热系数不断减小。相较于普通墙板,15%相变材料含量的定形相变墙板内表面峰值温度最高可降低4.9℃,峰值热流最高可降低41.80%,墙板的导热系数为0.3246 W·m^-1·K^-1,下降了70.45%。LA-TD/SiO2定形相变墙板具有显著的调温与节能性能。

LA-TD/SiO2 shape stabilized phase change material(ssPCM)wallboards with ssPCM content of 5%,10%and 15%were prepared respectively by direct mixing method.The high-low temperature alternating test chamber was used to simulate outdoor temperature environment in summer.The thermal performance of the ssPCM wallboards was studied from three aspects such as the temperature of the inner and outer surface of the wallboards,the heat flux on the inner surface of the wallboards and the thermal conductivity of the wallboards.The results show that,with the increase of the content of ssPCM,the peak temperature and peak heat flux of the inner surface of the ssPCM wallboards gradually decrease,and the thermal conductivity decreases.Compared with the cement wallboard,the peak temperature of the inner surface of the ssPCM wallboard with 15%ssPCM content can be reduced by up to 4.9℃,the peak heat flux can be reduced up to 41.80%,the thermal conductivity of the wallboard decreases by 70.45%,which is 0.3246 W·m^-1·K^-1.LA-TD/SiO2 ssPCM wallboard has significant temperature regulation and energy saving performance.