电工钨铜复合材料的研究进展

Research progress of electrical tungsten copper composites

钨铜复合材料是由互不相溶的钨和铜形成的"假合金",其具有钨的耐高温、高密度及低线膨胀系数和铜的高热导率及高导电系数,且高温下钨铜复合材料可通过铜的液化与蒸发带走大量热量,冷却钨骨架,因此钨铜复合材料广泛应用于电触头材料。介绍了液相烧结法、溶渗法、机械合金化法及真空热压法等电工钨铜复合材料的制备技术,阐述了粉末粒度、烧结温度及掺杂对电工钨铜复合材料性能的影响,并对其存在问题和发展方向进行了总结。

Tungsten-copper composites are a kind of "pseudo-alloy" formed by tungsten and copper which are incompatible with each other. It not only has high temperature resistance,high density and low linear expansion coefficient of tungsten,but also has high thermal conductivity and high electrical conductivity of copper,and at high temperatures,tungsten-copper composites can take away a lot of heat through the liquefaction and evaporation of copper,thereby cooling the tungsten skeleton. so tungsten copper composite materials are widely used in electrical contact materials. This paper introduces the preparation technologies of electrical tungsten-copper composite materials,such as liquid phase sintering,solution infiltration,mechanical alloying and vacuum hot pressing. The effects of powder size,sintering temperature and doping on the properties of electrical tungsten-copper composite materials are described,and the existing problems and development direction are summarized.