摘要
随着天线产品的结构日新月异,其互联焊点涌现出许多区别于传统焊点的结构特征,以至于工艺方法和质量可靠性存在大量未知。基于所遇到的某课题共型天线产品,对涉及的一种非标插装焊点开展了工艺研究,通过分析其结构特点和影响因素,依托正交试验设计了工艺样件,结合检验手段和数据统计确认了焊点结构的优劣性,给出了推荐尺寸,最终达到了环境试验要求。
With the rapid development of the structure of antenna products,the interconnect solder joint emerges some structure characteristics which are different from those of the traditional solder joints,so that there are a lot of unfamiliar possibility on the process method and quality reliability of antenna.Based on the need of conformal antenna of a certain project encountered,the process research for one non-standard through hole solder joint is introduced.By means of analysis for structure characteristics and influence factors,the process samples for orthogonal test are designed.After inspection and data statistics the quality of solder structure is confirmed,and the recommended size is given.Finally,it meets the requirements of environmental test.
作者
李杨
李亮
胡雅婷
LI Yang;LI Liang;HU Yating(The 29th Research Institute of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2020年第5期267-270,共4页
Electronics Process Technology
关键词
共型天线
非标焊点
工艺
正交试验
conformal antenna
non-standard solder
process
orthogonal test
