摘要
焊点的机械性能取决于焊点的微观组织,而微观组织取决于焊料组分、被焊接基底金属、焊点的结构以及焊接时的工艺条件。实际的制造中,如果忽略了焊点结构和工艺条件对焊点微观组织的影响,将可能形成严重劣化的焊点机械性能,进而形成影响焊点可靠性的不良的微观组织。主要介绍一些常见的不良微观组织,以便意识到高可靠性焊点的形成不是“随便”可以实现的,不是仅看看外观符合IOPC-A-610的要求就可以了,必须关注工艺的细节,确保焊点的微观组织符合要求。
The mechanical properties of the solder joints depend on the microstructure of the solder joints,and the microstructure depends on the composition of solder,the base metal to be soldered,the structure of the solder joints,and the soldering process conditions.In the actual manufacturing,if the influence of solder joint structure and process conditions on the microstructure of solder joint is ignored,the mechanical properties of solder joint will be seriously deteriorated,thus poor microstructure affecting the reliability of solder joints will be formed.Some common poor microstructure is introduced to realize that the formation of highly reliability solder joints can not be achieved"casually".It is not enough to just look at the appearance to meet the requirements of IOPC-A-610.It is necessary to pay attention to the details of the process to ensure that the microstructure of solder joints meets the requirements.
作者
贾忠中
李一鸣
刘万超
JIA Zhongzhong;LI Yiming;LIU Wanchao(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)
出处
《电子工艺技术》
2020年第5期305-310,共6页
Electronics Process Technology
关键词
焊点性能
微观组织
焊点结构
工艺条件
可靠性
solder joint performance
microstructure
solder joint structure
process condition
reliability