一种高可靠性环氧树脂组合物的制备

Preparation of a High-Reliability Epoxy Resin Composition

环氧塑封料是微电子工业和技术发展的基础材料,作为封装的三大主材料之一,随着封装产品向小型化、薄型化发展,对主材之一的环氧塑封料的性能要求也越来越高。同时军工类电子产品也越来越多地以环氧塑封料封装取代原有的陶瓷封装,所以需要开发出满足军工类电子产品使用要求的环氧塑封料。EK-5600GYG就是在此要求基础上开发出来的产品,分别介绍了此款塑封料的测试数据、可靠性测试结果和客户端可靠性评估结果。此产品具有低吸湿率、高粘接力及高可靠性的特点。

Epoxy molding compound is the basic materials in microelectronics industrial and technological development,as one of the three main materials in the IC products molding process,with the development of packaging products to miniaturization and thinness,the performance requirement of epoxy molding compound are becoming higher and higher.At the same time,more and more original ceramic packing be replaced by epoxy molding compound packaging,therefore,it is necessary to develop characters that meets the requirement of military products.The green compound of EK5600GYG is the product developed on the basis of this requirement.This product has the character such as low moisture absorption,high adhesion and high reliability,at the same time,this paper also introduced the test data,reliability test results and client reliability result.