陶封DIP在平移式自动化设备上的测试筛选研究

Study on Testing and Screening of Ceramic Sealed DIP on Translational Automation Equipment

目前市面上平移式自动化筛选设备能支持筛选的集成电路封装形式主要有SOP、BGA、QFN、QFP、CSP等,却无DIP封装(Dual In-Line Package,双列直插式封装)。讨论了DIP陶瓷封装在平移设备上筛选的难点,一是DIP封装的集成电路管脚长,导致集成电路在自动筛选过程中搬运困难;二是集成电路测试前后在测试座中插拔困难。针对两个难点需对平移设备进行定制性改造,研制设计出相关机构配合平移设备使用。经过多次的试验验证,最终解决了平移设备上无法测试筛选DIP封装集成电路的问题,增强了平移设备的生产兼容性,填补了市场空白。

At present,the integrated circuit packaging forms that can support screening by translational automatic screening equipment on the market are mainly SOP,BGA,QFN,QFP,CSP,etc.,but there is no DIP package(Dual In-Line Package).This paper describes the difficulties and solutions of screening DIP ceramic seal on the translation equipment.The difficulties are as follows:first,the long pin of the DIP package integrated circuit makes it difficult to carry the integrated circuit in the automatic screening process;second,before and after the IC test,it is difficult to plug and unplug in the test seat.In view of the above two difficult problems,it is necessary to carry out customized transformation of the translation equipment,develop and design relevant institutions to cooperate with the application of the translation equipment.After many trials and verifications,the problem of the inability to test and screen DIP packaged integrated circuits on the translation equipment was finally solved,the production compatibility of the translation equipment was enhanced,and the market gap was filled.