摘要
银具有高导电导热、耐腐蚀、抗氧化、延展性好等特性,制粉后添加不同合金元素与助焊剂以合适的比例混合制得的焊膏,在金属焊接与电子表面装联领域有着广泛的应用。结合近年来银基焊膏的最新研究进展,综述了银基焊膏中焊粉与助焊剂的研究现状,展望了银基焊膏的发展趋势。
Silver has the characteristics of high conductivity,high temperature resistance,corrosion resistance,and good ductility.When powder is made,different alloying elements and fluxes are mixed in a suitable ratio to prepare solder pastes that are widely used in the field of metal welding and electronic surface mount application.Combining with the latest research progress of silver-based solder paste in recent years,this article reviews the two major components of silver-based solder paste:the research status of solder powder and flux,and prospects the future development trend of silver-based solder paste.
作者
范玉曼
赵君
魏明霞
王剑平
高勤琴
谢明
FAN Yu-man;ZHAO Jun;WANG Jian-ping;GAO Qin-qin;XIE Ming(Kunming Insitute of Precious Metals,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.Ltd.,Kunming 650106,China;China Aviation Development Shenyang Liming Aviation Engine Co.Ltd.,Shenyang 110043,China)
出处
《贵金属》
CAS
CSCD
北大核心
2020年第S01期34-42,共9页
Precious Metals
基金
国家重点研发计划(2017YFB0305700)
国家自然科学基金(NSFC-云南联合基金)(U1602271,U1602275)
云南省稀贵金属材料基因工程(202002AB080001-1)。
关键词
银基焊膏
银基合金
助焊剂
silver-based solder paste
silver-based alloy
flux
