摘要
逐渐增大的集成度使得SoC芯片测试面临诸多新挑战。首先,概述了SoC芯片关键测试技术的国内外研究现状;然后,从SoC芯片系统级验证、SoC芯片高速信号测试和测试优化3个部分介绍了当前业界降低测试成本、提高芯片产品可靠性的关键技术手段;最后,展望了SoC芯片测试技术的发展方向。
Due to the gradual increase in integration,SoC testing face many new challenges.Firstly,the research status of key testing technologies of SoC at home and abroad are summarized.Then,the key technical means to reduce test costs and improve the reliability of chip product are introduced from the three aspects of SoC chip system level verification,SoC chip high-speed signal test and test optimization.Finally,the development direction of SoC testing technologies is prospected.
作者
龙伊雯
王小强
罗军
江凯
孙宇
LONG Yiwen;WANG Xiaoqiang;LUO Jun;JIANG Kai;SUN Yu(CEPREI,Guangzhou 510610,China)
出处
《电子产品可靠性与环境试验》
2020年第5期11-15,共5页
Electronic Product Reliability and Environmental Testing
关键词
片上系统
系统级验证
高速信号测试
测试优化
SoC
system-level verification
high speed signal testing
test optimization