Cu-Sn合金接触线孔洞缺陷分析

Analysis of Hole Defects of Cu-Sn Alloy Contact Wire

在检测过程中发现,Cu-Sn合金接触线存在孔洞缺陷,通过分析接触线机电性能、金相组织及断口形貌,指出孔洞缺陷的产生是由于铸造过程中冷却速度与上引速度不匹配造成的,并提出改进建议,以减少接触线孔洞缺陷发生概率。

Cu-Sn alloy contact wires are found with hole defects in the process of testing.Through the analysis of me⁃chanical and electrical properties,metallographic structure and fracture morphology of the contact wires,it is pointed out that such defects are caused by the mismatching of cooling speed and up-drawing speed control in the casting pro⁃cess,and corresponding suggested improvements are proposed to reduce the hole defects of contact wires occurrence probability.