双级HPPMS靶电流对TiN镀层微观结构及耐蚀性的影响

Effect of Target Current of Dual-stage HPPMS on the Microstructure and Corrosion Resistance of TiN Coatings

为了解决传统高功率脉冲磁控溅射(HPPMS)平均沉积速率低的问题,研究提出一种新型的双级HPPMS技术,即在一个脉冲周期内具有两个连续的、独立可调的脉冲阶段。通过对双级HPPMS电场的合理调配,可制备得到结构致密的TiN镀层,研究了双级HPPMS靶电流对TiN镀层微观结构及耐蚀性的影响。结果表明,当靶电流增大至20 A时,靶面形貌由小凹坑转变为大面积凹坑,说明镀料粒子的脱靶方式由碰撞溅射转变为升华或蒸发。同时,当靶电流为10 A时,镀层颗粒呈现三棱锥状结构,平均晶粒尺寸为11 nm;当靶电流增大至25 A时,镀层颗粒呈现光滑致密的圆胞状结构,平均晶粒尺寸为18 nm,光滑致密的组织结构使镀层具有较好的耐蚀性。

A dual-stage high power pulsed magnetron sputtering(HPPMS)technique,which has two continuous and independently adjustable steps in one pulse period,was developed in order to solve low deposition rate of traditional HPPMS.Through the reasonable allocation of electric field of dual-stage HPPMS,a fine and dense structure of TiN coating was prepared.The effects of target current of dual-stage HPPMS on the micro structure and corrosion resistance of TiN coating were studied.It is found that the morphology of target surface changed from small pits to large-area craters when target current increased to 20 A.It indicated that the leave-target mode of deposited particles changed from sputtering to sublimation or evaporation.Additionally,when target current was 10 A,the TiN coating exhibited pyramid-shaped particles with average grain size of 11 nm.When target current increased to 25 A,the TiN coating showed a circular shape particles with average grain size of 18 nm and dense columnar structure This micro structure gave rise to a better corrosion resistance.