头皮屑的发生机制及去屑方法的研究进展

The Mechanism of Dandruff and Research Status of Anti Dandruff

头皮屑是头皮角质细胞过度增生而引起的大量脱屑现象,是一种慢性、易复发、较常见的头皮问题。关于头皮屑的发生机制是多因素的,其中头皮微生态失衡、皮脂分泌过量和头皮角质层屏障受损是最重要的3个因素。本文全面阐述了头皮屑的发生机制,推断微生态、皮脂分泌、头皮屏障受损这三者可能的相互作用关系。对去屑产品如何达到满意的去屑效果进行了探讨,并展望了未来去屑产品的发展趋势,为头皮屑的治疗提供了新思路。

Dandruff is a large amount of desquamation caused by excessive proliferation of scalp keratinocytes, which is a chronic, recurrent and common scalp problem. The mechanism of dandruff is multifactorial, among which the imbalance of scalp microecology, excessive sebum secretion and the damage of cuticle barrier are the most important three factors. In this paper, the mechanism of dandruff formation is discussed, and the possible interaction among microecology, sebum secretion and scalp barrier damage is inferred. This paper also discusses how to achieve satisfactory effect of anti-dandruff products, and looks forward to the development trend of anti-dandruff products in the future, which provides new ideas for the treatment of dandruff.