摘要
研究了烧结处理对微波真空电子器件电镀镍层厚度、表面形貌和表面粗糙度的影响。结果表明,烧结令电镀镍层厚度减小,结构变得更密实,表面粗糙度增大。镍镀层与基体牢固结合,真空钎焊后的气密性满足微波真空电子器件的使用要求。
The effect of sintering treatment on the thickness,surface morphology,and roughness of electroplated nickel coating on microwave vacuum electronic device was studied.The results showed that the nickel coating became thinner,compacter,and rougher after being sintered.The nickel coating bonded tightly to the substrate,and the air tightness of the vacuum brazed part met the requirements of microwave vacuum electronic device.
作者
张帅
王小霞
罗积润
吴质洁
ZHANG Shuai;WANG Xiaoxia;LUO Jirun;WU Zhijie(Aerospace Information Research Institute,Chinese Academy of Sciences,Beijing 100094,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2020年第19期1344-1347,共4页
Electroplating & Finishing
关键词
微波真空电子器件
电镀镍
气密性
表面形貌
粗糙度
microwave vacuum electronic device
nickel electroplating
air tightness
surface morphology
roughness
