光敏聚苯并噁唑的研究现状与发展趋势

Research Status and Development Trend of Photosensitive Polybenzoxazole

作为耐热光敏绝缘介质材料的典型代表之一,光敏聚苯并噁唑(PSPBO)具有优异的力学性能、耐热性能、绝缘性能、低吸水率、低介电常数及突出的光刻成型能力,被广泛应用于微电子、航空航天等重要领域。特别地,在集成电路半导体封装中,光敏聚苯并噁唑被广泛应用于层间介质材料、应力缓冲层及保护层等,是扇出型封装等先进制程的关键材料。另外,随着5G高频高速通信、柔性显示、OLED等领域的快速发展,产业界对该类材料提出了更高的要求,比如低温固化、高粘结强度、低介电常数、导热等。更为重要的是,我国尚未掌握该材料的核心技术。本文综述了光敏聚苯并噁唑的发展概况和最新的研究进展,包括正性光敏聚苯并噁唑、负性光敏聚苯并噁唑以及光敏聚苯并噁唑的应用发展,最后对其发展前景进行了展望,以期为我国光敏聚苯并噁唑等耐热光敏聚合物基础研究与产业应用提供参考。

As one of the typical thermal stable photosensitive dielectric materials,photosensitive polybenzoxazole(PSPBO)exhibits excellent mechanical properties,heat resistance,insulation properties,low water absorption,low dielectric constant and outstanding lithographic properties.It has been widely used in some key areas such as microelectronics and aerospace.In particular,PSPBO is widely employed in interlayer dielectric materials,stress buffer layers and protective layers in integrated circuit semiconductor packaging,being a key material for advanced processes in fan-out packaging.On the other hand,with the rapid development of 5G high-frequency and high-speed communication,flexible display and OLED et al.,higher requirements of low temperature curing,high adhesive strength,low dielectric constant,and thermal conductivity have been raised.More importantly,core technology of PSPBO is absent in China.This mini-review describes the development of PSPBO,including positive-working PSPBO,negative-working PSPBO and the development of their applications.At the same time,some novel development prospects are prospected.We hope that this mini-review could provide useful information to Chinese researchers for the basic research and industrial applications of PSPBO.