ChCl-EG低共熔溶剂中Ni的电沉积行为研究

Study on Electrodeposition Behavior of Ni in CHCl-EG Deep Eutectic Solvent

对氯化胆碱-乙二醇(Ch Cl-EG)低共熔溶剂中Ni的电沉积行为进行研究。采用循环伏安法和计时电流法研究了Ch Cl-EG低共熔溶剂中电沉积Ni的电化学行为、成核生长机理,利用扫描电子显微镜(SEM)、能谱分析(EDS)对电沉积得到的镀层进行微观形貌和元素组成分析。结果表明,ChCl-EG低共熔溶剂的电化学窗口为2.55V,在ChCl-EG低共熔溶剂中镍的氧化、还原电位分别是0.1V、-0.96V,还原过程为一步还原,电极还原反应不可逆,镍沉积的成核机理属于三维瞬时成核,得到的镍镀层平整、致密。

The electrodeposition behavior of Ni in choline chloride-ethylene glycol(ChCl-EG) deep eutectic solvent was studied. The electrochemical behavior and nucleation growth mechanism of electrodeposited Ni in ChCl-EG deep eutectic solvent were investigated by cyclic voltammetry and chronoamperometry. The microstructure and element composition of the Ni coating were analyzed by SEM and EDS. The results show that the electrochemical window of ChCl-EG deep eutectic solvent is 2.55V, and the oxidation and reduction potentials of nickel in ChCl-EG deep eutectic solvent are 0.1 V and -0.96V, respectively. The reduction process is one-step reduction, and the electrode reduction reaction is irreversible. The nucleation mechanism of Ni electrodedeposition belongs to three-dimensional instantaneous nucleation, and the Ni coating is uniform distribution and compactness.