4500V芯片塑封用聚酰亚胺/GF复合材料的制备与性能

Preparation and Properties of Glass Fiber Reinforced Polyimide Composite for 4500V Chip Plastic Package

采用双螺杆挤出机熔融共混工艺,制备了玻璃纤维(GF)增强聚酰亚胺(PI)复合材料,研究了玻璃纤维用量对PI/GF复合材料力学性能、动态力学性能、电性能及热性能的影响。研究结果表明,随GF用量增加,材料的拉伸强度、拉伸模量、弯曲强度显和电气强度显著增加,与纯料相比,当加入40%玻璃纤维时,复合材料的拉伸强度、拉伸模量、弯曲强度和电气强度分别提升了46.1%、295.4%、80.4%、12.4%;其介电损耗和介电常数逐渐降低,悬臂梁无缺口冲击强度呈先增加后降低的趋势。利用动态热力学分析仪(DMA)研究发现,随着GF用量的增加,复合材料储能模量呈增加趋势;热失重(TGA)数据分析结果表明,随着GF用量增加,复合材料的热稳定性能逐渐增加。

The preparation of glass fiber( GF) reinforced polyimide( PI) composite with double screw extruder melt blending process,the glass fiber dosage on PI/GF composite material mechanical properties,dynamic mechanical properties,the influence of the electrical and thermal properties,the results showed that with the increase of dosage of GF,the tensile strength,tensile modulus,bending strength and electrical strength significantly increased,compared with the pure material,adding 40% glass fiber tensile strength,tensile modulus,bending strength and the electric strength of 46. 1%,295. 4%,80. 4% and 12. 4%,respectively;the dielectric loss and dielectric constant decreased gradually and the notched impact strength of the cantilever beam increases first and then decreases. Dynamic thermal-mechanical analyzer( DMA) found that with the increase of GF amount,the composite material energy storage modulus showed an increasing trend. Thermogravimetric( TGA) data analysis showed that the thermal stability of composite increased with the increase of GF dosage.