摘要
电磁兼容性是电路设计中的一个重要问题。文章从叠层、布局以及布线等方面,提出了高速PCB设计过程中增强电磁兼容性的方法,以优化高速电路PCB设计及缩短产品的开发周期。
EMC is an important problem in the circuit PCB design.From the aspects of stack up,layout and wiring,a method to enhance electromagnetic compatibility in the high-speed PCB design process was proposed to optimize the high-speed circuit PCB design and shorten the product development cycle.
作者
杨亭
田世锋
YANG Ting;TIAN Shifeng(Guangdong Vocational school of Polytechnic,Guangzhou 510500,China)
出处
《电工技术》
2020年第20期150-151,共2页
Electric Engineering
