含金属间化合物的Al基合金半固态加压连接Si_3N_4陶瓷

Semisolid state pressure bonding of Si_3N_4ceramics with Al-based alloys containing intermetallic compounds

用含金属间化合物Al3Ti或Al3Zr的Al基合金作连接材料,研究了半固态加压连接Si3N4陶瓷时接头的形成,以及Al基合金种类和连接压力对接头组织与强度的影响。结果表明:半固态连接可获得性能良好的陶瓷接头;连接过程中加压能提高连接层金属中耐高温金属间化合物的含量,达到提高接头高温性能的目的;连接压力适当时,接头在室温和600℃下的剪切强度可分别达到126～136MPa和32～34MPa,明显比用纯Al连接的接头强度高;在结合界面形成过程中,第二活性元素Ti和Zr也参与了界面反应。

 Si3N4 ceramics were bonded with Albased alloys containing intermetallic compounds Al3Ti or Al3Zr using a semisolid state pressure bonding method. Numerous tests investigated the joint formation with this new bonding method and the effects of the intermetallic compounds and the bonding pressure on the microstructures and strengths of the joints. Joints with excellent properties were obtained using the method. High bonding pressures increased the intermetallic compound content in the joints and improved the joint heatresistant properties. The joint shear strength at room temperature was 126~136 MPa and at 600 ℃ was 32~34 MPa, with suitable bonding pressures. The Ti or Zr in the Albased alloys reacts with the Si3N4 ceramic during the bonding.