摘要
为了提高芯片级封装发光二极管(CSP-LED)焊点疲劳寿命,利用有限元仿真软件ABAQUS模拟计算了CSP-LED芯片在跌落冲击载荷下焊点的塑性应变,并研究了裂纹拓展趋势。以焊点失效前跌落次数为指标,利用Coffin-Manson经验公式计算焊点寿命,研究了底部填充物对CSP-LED芯片在不同冲击载荷下焊点寿命的影响。结果表明,随着冲击载荷增大,焊点疲劳寿命减少,使用填充物能使芯片焊点寿命提高4~6倍,其影响通过跌落实验和仿真结果的对比得到了验证。
In order to improve fatigue life of solder joint of chip scale package light-emitting diode(CSP-LED),the finite element simulation software ABAQUS was used to simulate the plastic strain of CSP-LED packaged chip under the drop load,and the crack propagation trend was studied.The number of drops before the solder joint failed was taken as an index,and the Coffin-Manson empirical formula was used to calculate the fatigue life of the solder joint.The effect of underfill on the solder joint life of the CSP-LED chip under different impact loads was investigated.The results showed that as the impact load increases,the fatigue life of the solder joint decreases,and the fatigue life of the solder joint could be improved by 4 to 6 times by using underfill,and the influence was verified by comparing the results of drop experiment and the results of simulation.
作者
傅志红
田有锵
武宁杰
郭鹏程
王洪
FU Zhihong;TIAN Youqiang;WU Ningjie;GUO Pengcheng;WANG Hong(College of Mechanical and Electrical Engineering,Central South University,Changsha 410083,P.R.China;Zhongshan Instit.of Modern Indust.Technol.of South China Univ.of Technol.,Zhongshan,Guangdong 528437,P.R.China)
出处
《微电子学》
CAS
北大核心
2020年第5期699-703,共5页
Microelectronics
基金
广东省科技计划重大项目(2015B010127013,2016B01012300,2017B010112003)
中山市科技发展专项资金重大项目(2017F2FC0002,2017A1009,2019AG014)。
