钨铜合金与铜扩散连接界面结构及性能研究

Microstructure and Mechanical Properties of Diffusion Bonding Joints Between WCu10 and Cu

采用BAg72Cu中间层,在800℃/4 MPa/20 min的工艺条件下,对WCu10/Cu进行了真空扩散连接,对扩散连接接头的界面形貌、元素分布、显微硬度和抗拉强度进行了研究。结果表明:采用BAg72Cu中间层能够实现WCu10与Cu的有效连接,接头各界面完好,结合紧密,无裂纹、孔洞等焊接缺陷;接头的平均抗拉强度为217.6 MPa;通过断口形貌及EDS扫描发现接头断裂位置发生在WCu10/BAg72Cu界面处,断裂方式属于沿晶断裂和韧窝断裂组成的混合断裂。

The diffusion bonding between WCu10 and Cu was investigated at 800℃for 20 min with 4 MPa,using BAg72Cu foil as interlayer.The microstructure,phase compositions,micro-hardness and tensile strength of joints were observed and measured.The results showed that the joints interfaces were intact and tightly combined without any cavity or cracking defects.The average tensile strength of the joints was 217.6 MPa.According to the morphology of the joints and EDS scanning,the results showed that the tensile fracture occurred at the WCu10/BAg72Cu interface,and the fracture mode was a mixture of brittle intercrystalline fracture and dimple ductile fracture.