摘要
随着电子产业的高速发展,覆铜板的性能也在不断进步。文章针对覆铜板生产中有机溶剂的研究,表明有机溶剂的使用对覆铜板的玻璃化转变温度的影响大,通过高低沸点溶剂的配合使用,可使得基板的玻璃化转变温度提高,相关的物性达到最佳状态。
With the development of electronic industry,the performance of CCL is also improving.In this paper,the research of organic solvent in the production of Copper Clad Laminate shows that the use of organic solvent has an impact on the glass transition temperature of Copper Clad Laminate.Through the use of high and low boiling point solvent,the glass transition temperature of the substrate is increased,and the physical properties reach the best state.
作者
李永平
谢长乐
Li Yongping;Xie Changle(Linzhou Zhiyuan Electronic Technology Co.,LTD.Linzhou City Henan Province 456561)
出处
《印制电路信息》
2020年第10期12-15,共4页
Printed Circuit Information
关键词
覆铜板
有机溶剂
玻璃化转变温度
Copper Clad Laminate(CCL)
Organic Solvent
Glass Transition Temperature