摘要
POFV工艺是5G通讯电路板的关键技术之一,其复杂的制作流程给产品的品质带来了诸多可靠性风险,其中孔破是主要问题。文章基于生产实践,分析了POFV工艺孔破的各种失效模式和产生原因,提出了有效的流程改善措施与建议。
POFV is one of the key process of 5G communication printed circuit boards,whose complex manufacturing process flow brings much reliability rick to PCB quality,and plating void is one of the main problems.This article is based on production practice to analysis every failure model and to state the root cause,and brings effective actions and suggestions to improve process control.
作者
付艺
马建
Fu Yi;Ma Jian(Zhuhai Founder Tech.Multilayer PCB Co.,Ltd,Delivery Center,Guangdong,Zhuhai 519175)
出处
《印制电路信息》
2020年第10期36-40,共5页
Printed Circuit Information
