磁控溅射-熔覆法制备铜/钼接头的组织与性能研究

Research on Microstructure and Properties of Cu/Mo Joint Prepared by Magnetron Sputter and Cladding Method

采用磁控溅射-熔覆法制备了铜/钼接头,并通过室温静态拉伸试验对其结合性能进行了测试。采用光学显微镜观察了Cu/Mo结合界面附近的显微组织,并利用扫描电镜(配X射线能谱仪)分析了断口形貌及Cu/Mo界面附近的Cu,Mo,Ni和Cr合金元素分布情况。结果表明,添加适量的Ni、Cr等合金元素可使结合界面形成4~5μm的扩散层,从而有利于铜和钼的连接。在5.0×10-3Pa真空度下,1200℃熔覆并保温60 min,然后缓慢冷却,制得接头的抗拉强度为156 MPa。钼和铜均发生了再结晶,其中钼的平均晶粒尺寸约为20μm,而铜的晶粒尺寸达数百微米。室温拉伸条件下,接头由钼侧发生脆性断裂,断口特征由心部到边缘依次为解理断裂、混合(晶间+韧窝)断裂、剪切断裂。

Cu/Mo joints were prepared by magnetron sputtering-fusion cladding technique and the bonding properties were tested by static tensile test at room temperature. The microstructure near the bonding interface of Cu/Mo was observed by optical microscope. Fracture morphologies were analyzed by scanned electron microscope and the concentration distribution of alloying elements such as Cu, Mo, Ni and Cr near the interface of Cu/Mo were determined by X-ray dispersion spectrometer. The results show that the addition of an appropriate amount of alloying elements such as Ni and Cr can lead to the formation of a diffusion layer of 4-5 μm in the bonding interface, thus being beneficial to the connection of copper and copper. At 5.0×10-3 Pa vacuum, the tensile strength of the joint is 156 MPa, when it is coated at 1200 ℃ and kept for 60 min,and then cooled slowly. Both Mo and Copper have been recrystallized. The average grain size of Mo is about 20 μm, while that of copper is hundreds of microns. Under the condition of room temperature tension, the brittle fracture occurs from the Mo side, and the fracture characteristics are cleavage fracture, mixed(intergranular dimple) fracture and shear fracture from the center to the edge.