PCB焊接端子优化设计研究

Research on PCB Soldering Terminal Optimization Design

PCB焊接端子是指应用于PCB电气连接的接线端子,是一种实现电气连接的元器件。大规格端子对焊接工艺要求较高,优化端子设计既能保证端子在使用时的电性能,同时又能保证其焊接加工过程中的工艺要求。该研究着眼于PCB焊接端子在回流焊焊接过程中温度变化,从端子的焊接性能出发,对端子优化设计,分析其在同一工艺过程炉温曲线的变化,同时分析端子结构优化前后的电性能的变化,讨论应用时电性能可靠性。基于有限元法建立PCB焊接端子回流焊焊接的热传导模型、端子的电传导模型,提出改善端子优化设计的思路,改善大规格端子焊接性能,并保证端子的电性能。

PCB soldering terminal is used in the electrical connection of PCB and the components.Bigger size terminals have high requirement on the soldering process.Optimizing the terminal design can not only ensure the electrical performance of the terminal in use,but also ensure the process requirements during the soldering process.This research focuses on the temperature change of the terminals during reflow soldering.The terminal is optimized for design based on the soldering performance of the terminals.The furnace temperature curve change during the same soldering process is analyzed.The electrical performance changes are analyzed.Based on FEA,the heat transfer model of soldering process and the electrical model of terminals are established.A design idea for improving the terminal design is proposed,which can improve the soldering performance of terminals and ensure the electrical performance in use.