高导热高频覆铜板用环氧/氰酸酯体系的研究

Study on the epoxy resin/cyanate ester system for high thermal conductivity and high frequency copper clad laminate

以双环戊二烯酚型环氧树脂(DCPDEP)和双酚A型氰酸酯树脂(CE)为基体树脂,加入导热填料氮化硼和硅微粉,增韧剂马来酸酐化聚丁二烯(MLPB)及硅烷偶联剂制备了覆铜板。研究了DCPDEP与CE的配比对体系半固化时间和介电性能的影响以及氮化硼用量对体系的导热性能及介电性能的影响。结果表明,当DCPDEP与CE的质量比为7∶3,氮化硼添加质量分数为27%时,制得的覆铜板的导热率为1.21 W/(m·K),10 MHz下的介电常数为3.59,介电损耗为0.006 4,综合性能最佳。

The copper clad laminates were prepared using dicyclopentadiene phenol epoxy resin(DCPDEP) and bisphenol A cyanate ester resin(CE) as matrix resins, adding thermally conductive filler boron nitride and silicon powder, toughening agent maleic anhydride polybutadiene(MLPB) and silane coupling agent. The effect of the ratio of DCPDEP to CE on the semi-curing time and dielectric properties of the system and the effect of boron nitride amount on the thermal conductivity and dielectric properties of the system were studied. The results showed that when the mass ratio of DCPDEP to CE was 7∶3 and the mass fraction of boron nitride added was 27%, the thermal conductivity of the prepared copper clad laminate was 1.21 W/(m·K). The dielectric constant and dielectric loss under 10 MHz was 3.59 and 0.006 4,respectively and the overall performance was the best.