真空封装微腔体残余气体压力及成分分析

Research on Residual Gas Pressure and Composition of Vacuum Packaging Microcavity

微腔体中的残余气体压力与成分对于真空封装器件至关重要。提出一种微体积封装器件的内部压力和残余气体分析技术,研制了测试平台,基于超高真空动态流导法,可对容积小于1 mL的真空封装微腔体内的气体压力和气体成分进行精确测量。选用微腔体容积为470μL的芯片进行实验测试,结果表明,芯片1和芯片2的残余气体压力分别为629.8 Pa和646.8 Pa;芯片3(封装和除气工艺经过优化)经老化处理后,内部残余气体压力下降一个量级,约为31.9 Pa;四极质谱计的实时监测结果为,芯片老化过程中的主要出气成分为CH4、N2和CO。

The pressure and composition of the residual gas in the microcavity are very important for the vacuum packaging devices.In the study,an analysis technology of the residual gas pressure and composition in the microcavity is proposed,and a test platform is developed.The platform is based on the ultrahigh vacuum dynamic conductance method,which can be applied to the residual gas pressure and composition in a small volume of less than 1 mL.In the experiment,the residual gas pressure and composition in 470μL chips were tested.The residual gas pressure of chip 1 and chip 2 were 629.8 Pa and 646.8 Pa respectively.Chip 3 optimized the packaging process.After aging,the internal residual gas pressure decreased by one order of magnitude,about 31.9 Pa.The quadrupole mass spectrometer has been used to monitor the gas pressure in real time.CH4,N2 and CO were the main gases in the chip aging process.