毫米波3D-MCM中垂直互联的设计

Design of vertical interconnection for 3D-MCM in millimeter-wave

3D-MCM是新一代有源相控阵共形天线的核心部件,设计小型化、低插入损耗和高可靠的垂直互联结构是实现3D-MCM关键技术之一。以小型化、连接可靠性、易集成、易加工为目的,提出一种应用于毫米波频段,基于左手传输线的同轴型非接触式垂直互联结构,使得不同功能模块之间通过电磁耦合的方式实现了信号的垂直传输。利用低温共烧陶瓷(LTCC)制造工艺,制作了背靠背同轴型非接触式垂直互联实物,单个垂直互联接口面积约3.14 mm^2,经测试在35~43 GHz频段内单个垂直互联插入损耗小于0.7 dB,带内平坦度优于±0.75 dB,回波损耗优于-12 dB。

Three dimensional microwave multi-chip modules are key parts of new generation active phased-array conformal antenna.Miniaturization,low insertion-loss and high reliability of vertical interconnection structure are crucial to realize 3D-MCM techniques.To design a small,reliable,easily integrated and readily manufacturable product,a coaxial non-contact vertical interconnection structure was proposed based on a novel left-handed transmission line of millimeter-wave,which can transfer radiofrequency(RF)signals vertically between the different functional modules through electromagnetic coupling.The back-to-back coaxial non-contact vertical interconnection was made by low temperature co-fired ceramic(LTCC)process.The area of a port is about 3.14 mm^2.The test results show that the insertion loss is less than 0.7 dB,flatness is less than±0.75 dB,and return loss is better than-12 dB in the 35-43 GHz band.