压接式SiC MOSFET模块

Press-pack SiC MOSFET Module

介绍了一种适用于SiC MOSFET的压接式封装方法。针对SiC MOSFET芯片面积较小的特点,使用弹性压针实现SiC MOSFET芯片上表面的压力接触。由于散热器同时也是电流通路,为减小由散热器引入的寄生电感,采用了一种厚度较薄且具有良好散热性能的微通道散热器。介绍了研制的压接式SiC MOSFET样品,并通过仿真和实验评估了样品的电、热特性,验证了所提出封装方案的可行性。

In this paper,a feasible press-pack packaging method for SiC MOSFETs is proposed.Aimed at the characteristics of the small die size of SiC MOSFET,flexible press pins are used to realize the die top-side pressure contact.Since an heatsink is also included in the current carrying path,to reduce the stray inductance introduced by the heatsink,a micro-channel heatsink is applied,which is thinner while remaining an adequate heat dissipation efficiency.A manufactured sample of press-pack SiC MOSFET is introduced.The thermal and electrical performances of the sample were evaluated by simulations and tests,and results verified the feasibility of the proposed packaging approach.