摘要
以含羧基化合物A或其铵盐B,又或焦磷酸钾作为辅助配位剂进行无氰电镀银。镀液的基础组成和工艺条件为:硝酸银5 g/L,丁二酰亚胺60 g/L,硼砂5~10 g/L,pH=9.5±0.5,温度20~30℃,磁力搅拌,时间30 min。研究了3种辅助配位剂对无氰电镀银光亮电流密度范围及银层光泽、结合力和表面形貌的影响。结果表明,采用化合物含羧基铵盐化合物B作为辅助配位剂时光亮电流密度范围为0.020~0.867 A/dm^2,所得银层的光泽高达579 Gs,结合力良好,组织结构受电流密度的影响较小。
Silver electroplating was conducted in a cyanide-free bath comprising silver nitrate 5 g/L,succinimide 60 g/L,borax 5-10 g/L,and auxiliary complexant(carboxyl-containing compound A or its ammonium salt B,or potassium pyrophosphate)at temperature 20-30℃and pH 9.5±0.5 under magnetic agitation for 30 min.The effects of different auxiliary complexants on the current density range for electroplating a bright silver coating,as well as its gloss,adhesion,and surface morphology were studied.The results showed that the current density range for electroplating a bright silver coating was 0.020-0.867 A/dm^2 when using the carboxyl-containing ammonium salt compound B as auxiliary complexant.The silver coating featured a gloss up to 579 Gs and good adhesion,and its structure was slightly affected by the change of current density in the said range.
作者
甘鸿禹
刘光明
黄超华
王洪火
刘明瀚
余辉
赵文浩
GAN Hongyu;LIU Guangming;HUANG Chaohua;WANG Honghuo;LIU Minghan;YU Hui;ZHAO Wenhao(School of Material Science and Engineering,Nanchang Hangkong University,Nanchang 330063,China;不详)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2020年第21期1457-1460,共4页
Electroplating & Finishing
基金
国家自然科学基金(51961028)。
关键词
无氰电镀银
丁二酰亚胺
辅助配位剂
结合力
光泽
组织结构
cyanide-free silver electroplating
succinimide
auxiliary complexant
adhesion
gloss
microstructure