无氰铜锡合金仿金电镀工艺及镀层性能

Non-cyanide imitation gold plating process and coating properties

在采用HEDP 15 g/L、AESS 24 mg/L和K2CO340 g/L作为复合添加剂的条件下,探讨了焦磷酸盐体系无氰铜锡合金仿金电镀配位剂和主盐浓度对镀层外观的影响,确定了以下最优工艺条件:K4P2O7·3H2O 240 g/L,Cu2P2O7·3H2O 16~18 g/L,Sn2P2O72.0~2.8 g/L。由此而电镀出的仿金镀层在黄铜基体上有良好的结合力,表面硬度比基体低,但耐磨性更好。复合添加剂对镀层的平整及抗磨损有一定的促进作用。

The concentrations of main salts and complexing agent on appearance of Cu-Sn alloy coating as an imitation of gold electroplated from a cyanide-free pyrophosphate bath were studied when using a composite additive comprising HEDP 15 g/L,AESS 24 mg/L,and K2CO340 g/L.The optimal conditions were determined as follows:K4P2O7·3H2O 240 g/L,Cu2P2O7·3H2O 16-18 g/L,and Sn2P2O72.0-2.8 g/L.The coating obtained thereunder was well-adhered to brass,and had better wear resistance than brass,although its surface hardness was lower than brass.The composite additive has a certain effect on improving the flatness and wear resistance of the coating.