聚酰亚胺薄膜飞秒激光蚀刻和激光诱导活化后化学镀铜

Electroless copper plating on polyimide thin film after femtosecond laser etching and laser-induced activation

以聚酰亚胺(PI)薄膜为基体,先通过飞秒激光进行刻蚀改性,再通过激光诱导活化在PI薄膜表面制备铜微粒,最后进行化学镀铜。研究了飞秒激光刻蚀功率对铜镀层覆盖率的影响,分析了蚀刻和活化前后PI薄膜的表面形貌和亲水性,以及铜镀层的微观结构、导电性和结合力。结果表明,当飞秒激光功率为30 mW时,蚀刻效果最佳。活化后,PI基体表面形成了大量铜微粒,化学镀铜后镀层的覆盖率高达100%,电阻率为3.8μΩ·cm,结合力良好。

Polyimide(PI)thin film was modified by femtosecond laser etching,and then copper particles were deposited on it by laser-induced activation for electroless copper plating.The effect of laser power on the coverage of electrolessly plated copper coating was studied.The surface morphology and hydrophilicity of PI thin film before and after being etched and activated were analyzed.The microstructure,electrical conductivity,and adhesion of copper coating were characterized.The result showed that the etching effectiveness was the best when the laser power was 30 mW.A large number of copper particles were formed on the surface of PI thin film after activation.The electrolessly plated copper coating was well-adhered to the PI thin film with a 100%coverage and had a resistivity of 3.8μΩ·cm.