摘要
采用化学镀与冷压烧结相结合的方式成功制得石墨烯均匀分布的铜/石墨烯复合材料。对比了纯铜和石墨烯质量分数不同的铜/石墨烯复合材料的微观形貌、热导率、电阻率、显微硬度和摩擦因数。结果表明,随着石墨烯质量分数的增大,铜/石墨烯复合材料的电阻率提高,热导率略降,显微硬度先增大后降低,摩擦因数显著降低。含1.5%石墨烯的铜/石墨烯复合材料的综合性能最佳。
Copper/graphene composites with graphene uniformly distributed were prepared by the combination of electroless plating and cold-pressing/sintering.The micromorphology,thermal conductivity,electrical resistivity,microhardness,and tribological properties of the copper/graphene composites with different contents of graphene and pure copper were compared.The results showed that the increase of graphene content in copper/graphene composite increases its resistivity,decreases its thermal conductivity slightly,makes its microhardness increase initially and then decrease,and decreases its friction factor greatly.The copper/graphene composite with 1.5wt.%of graphene had the best comprehensive performance.
作者
赵敬
彭倚天
ZHAO Jing;PENG Yitian(College of Mechanical Engineering,Donghua University,Shanghai 201620,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2020年第21期1481-1485,共5页
Electroplating & Finishing
关键词
铜
石墨烯
化学镀
热导率
电阻率
摩擦因数
copper
graphene
electroless plating
thermal conductivity
resistivity
friction factor
