高层数板内层孔线间距制程能力测试

Test of hole-to-line process capability of inner layer of high multilayer PCB

本课题主要研究多层板内层孔到线的极限生产能力。不同层数内层孔到线主要受生产底片涨缩、覆铜板自身涨缩、内层芯板两面图形对准度、叠层层偏、钻孔精度的影响,现结合实际的生产情况,重点管控影响因素,提升孔到内层导体的制程能力。

This topic mainly studies the limit production capacity of inner hole to line of multilayer PCB.The inner hole to line of different layers is mainly affected by the expansion and contraction of production master,the expansion and contraction of copper clad plate itself,the graphic alignment between the two sides of the inner core plate,the stacking deviation,and the drilling accuracy.Therefore,based on the actual production situation of the company,the author focuses on controlling the influencing factors to improve the process capacity of hole to inner conductor.