半导体封装行业MES系统的设计与研究

Design and Research of MES System in Semiconductor Packaging Industry

本文研究重点是半导体封装MES的设计与实现,为满足企业高效、实用、先进的管理需求,力求实现芯片封装工艺过程的可视化操作。首先要熟悉半导体封装业务流程以及系统功能需求,采用C/S三层模型架构实现半导体MES系统功能设计及实现,致力于实现一款符合半导体封装行业的MES系统,方便产线人员收集生产一线的实时数据,便于上层管理人员及时获取产线实时数据进行投产生产计划,从而提高企业的生产效率。

This paper focuses on the design and implementation of semiconductor packaging MES.In order to meet the needs of efficient,practical and advanced management of enterprises,we strive to realize the visual operation of chip packaging process.First of all,we should be familiar with the semiconductor packaging business process and system function requirements.We should use C/S three-tier model architecture to realize the function design and implementation of semiconductor MES system.We are committed to realizing a MES system that is in line with the semiconductor packaging industry.It is convenient for the production line personnel to collect the real-time data of the production line,so that the upper management personnel can timely obtain the real-time data of the production line and carry out the production plan Improve the production efficiency of enterprises.